TSMC will invest an additional $11 billion in its Dresden facility, doubling planned European wafer output for AI accelerators and consolidating Germany's position as the centre of gravity for advanced-node manufacturing on the continent.
The expansion, announced jointly with Infineon and Bosch, is partially funded by the EU Chips Act and is expected to add 3,200 jobs by 2030.
European Commission officials said the deal validates the bloc's industrial-policy turn since 2023.